ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,676, issued on Nov. 3, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan). "Manufacturing method of overlay mark" was invente... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,677, issued on Nov. 3, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Material layer deposition methods, semiconductor processi... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,678, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Dynamic exhaust for chemical processi... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,679, issued on Nov. 3, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea). "Integrated exhaust duct and substrate processing ap... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,680, issued on Nov. 3, was assigned to LINTEC Co. LTD. (Shiga, Japan). "Vaporizer" was invented by Hirofumi Ono (Otsu, Japan). According to... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,681, issued on Nov. 3, was assigned to DISCO Corp. (Tokyo). "Method of handling wafer" was invented by Masaru Nakamura (Tokyo) and Kohei Tsu... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,682, issued on Nov. 3, was assigned to NEXTIN INC. (Gyeonggi-do, South Korea). "Semiconductor manufacturing apparatus" was invented by Seoun... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,683, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Wafer-level die-transfer tool and... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,684, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Chip ejecting apparatus and method" was invent... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,685, issued on Nov. 3, was assigned to CANON K.K. (Tokyo). "Apparatus including a non-contact die head and a substrate chuck and a method of... Read More